Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80 ºC;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: PCB Assembly;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB Fabrication, PCB Assembly, Box Build;
Other PCBA Service: Conformal Coating;
Applicaton: Industrial SMT PCB PCBA;
Service: Board Circuit Custom;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
PCB Factory: Yes;
Certificate Gurantee: Yes;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: PCB Assembly;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB Fabrication, PCB Assembly, Box Build;
Other PCBA Service: Conformal Coating;
Applicaton: Industrial SMT PCB PCBA;
Other Service: FPC;
PCB Service: Flexible PCB;
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