Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
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Metal Coating: Copper;
Mode of Production: DIP;
Selling Units: Single Item;
Single Gross Weight: ["35.000kg","35.000 Kg"];
Brand Name: Pcie;
Products Status: Stock;
Product Name: RAID Card Perc H745 Perc;
Private Mold: No;
Product Type: RAID Card;
Place of Origin: Fujian,China;
Model Number: RAID Card Perc H745 Perc;
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Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
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