Wireless Raspberry Pi Compute Module 4 Cm4108000 Embedded Single Board Computer pictures & photos

Wireless Raspberry Pi Compute Module 4 Cm4108000 Embedded Single Board Computer

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Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

Metal Coating Tin
Mode of Production SMT
Layers Single-Layer
Base Material PCB
Certification RoHS, CCC
Customized Non-Customized
Condition New
Transport Package Air Express
Specification 1 piece/box
Trademark CENTURY SOLUTIONS
Origin GB
Form Factor 55mm * 40mm
Processor Broadcom Bcm2711
Input Power DC 5V
Operating Temperature 0 ~ 80 ℃

Product Description

Raspberry Pi Compute Module 4 (CM4) Raspberry Pi Compute Module 4 harnesses the compute power of the popular Raspberry Pi 4 Model B, bringing it to a smaller form factor suitable for integration into products. Key features include a high-performance 64-bit quad-core processor, dual-display ...

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CENTURY SOLUTIONS LIMITED

Gold Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(10 Reviews)

Main Products Wireless Carplay Adapter, Wireless Android Auto Adapter, Wireless Carplay with HDMI, ...
Year of Establishment 2023-02-21
Number of Employees 8
Address No. 5 Room 302, 3rd Floor, 2nd Building C, Dangdai International Garden, Guanfeng Ave No. 2, Donghu Development Area, Wuhan, Hubei, China

Compute Module 4 Comparison

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Transaction Info
	Wireless Raspberry Pi Compute Module 4 Cm4108000 Embedded Single Board Computer Contact Now	Quick View PCB Assembly PCBA Manufacturer Motor Control Board for Icecream Machine Contact Now	Quick View PCBA Manufacturer SMT DIP Technology Electrical Components PCB Assembly Service Contact Now	Quick View Professional Manufacture PCB Assembly Factory Medical Equipment PCBA Board Contact Now	Quick View OEM PCBA Bom Gerber File Service Electronic Components PCB Assembly Manufacture Contact Now
Price	Negotiable	US$0.76-5.00 / Piece	US$3.68-9.00 / Piece	US$0.20-20.00 / Piece	US$0.87-5.00 / Piece
Min Order	1 Piece	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T	T/T	T/T	T/T
Quality Control
Product Certification	RoHS, CCC	RoHS, ISO	ISO	RoHS, ISO	RoHS, CCC, ISO
Management System Certification	-	ISO9001:2015	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Base Material: PCB; Customized: Non-Customized; Condition: New; Form Factor: 55mm 40mm;* Processor: Broadcom Bcm2711; Input Power: DC 5V; Operating Temperature: 0 ~ 80 ℃;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	CENTURY SOLUTIONS LIMITED	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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