Compute Module 4
Negotiable
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What is New and Orignial Embedded Computer Raspberry Pi Cm4 Cm4002000 2g RAM Module

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material PCB
  • Certification RoHS, CCC
  • Customized Non-Customized
  • Condition New
  • Transport Package Paper Box
  • Specification 1 piece/box
  • Trademark CENTURY SOLUTIONS
  • Origin GB
  • Form Factor 55mm * 40mm
  • Processor Broadcom Bcm2711
  • Input Power DC 5V
  • Operating Temperature 0 ~ 80ºC

Product Description

Raspberry Pi Compute Module 4 harnesses the compute power of the popular Raspberry Pi 4 Model B, bringing it to a smaller form factor suitable for integration into products. Key features include a high-performance 64-bit quad-core processor, dual-display support at resolutions up to 4K, hardware ...

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Compute Module 4 Comparison
Transaction Info
Price Negotiable US$1.00 - 50.00 / Piece US$1.00 - 50.00 / Piece US$1.00 - 50.00 / Piece US$1.00 - 50.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
Quality Control
Product Certification RoHS, CCC RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80ºC;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model No.: 0563;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model No.: 0563;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model No.: 0563;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model No.: 0563;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Supplier Name

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier