Raspberry Pi Cm3+8GB Compute Module 3 Plus

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$20.00-100.00 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material PCB
  • Certification RoHS, CCC
  • Customized Non-Customized
  • Condition New
  • Transport Package Paper Box
  • Specification 1 piece/box
  • Trademark CENTURY SOLUTIONS
  • Origin GB
  • RAM 1GB Lpddr2 Sdram
  • Emmc 8GB
  • Processor Broadcom Bcm2837b0
  • Other Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz
  • Application IoT/Ai

Product Description

Raspberry Pi Compute Module 3+ (CM3+) The Compute Module 3+ (CM3+) is a Raspberry Pi 3 Model B+ in a flexible form factor, intended for industrial applications. Specification The CM3+ Compute Module contains the guts of a Raspberry Pi 3 Model B+ (the BCM2837 processor and 1GB RAM) as ...

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Transaction Info
Price US $ 20.00-100.00/ Piece US $ 2.16-3.70/ Piece US $ 1.00-20.00/ Piece US $ 1.00-20.00/ Piece US $ 1.00-20.00/ Piece
Min Order 1 Pieces 5 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, CCC - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001 - ISO 9001, IATF16949, QC 080000 ISO 9001, IATF16949, QC 080000 ISO 9001, IATF16949, QC 080000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model - - OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
RAM: 1GB Lpddr2 Sdram;
Emmc: 8GB;
Processor: Broadcom Bcm2837b0;
Other: Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz;
Application: IoT/Ai;
Sku: Ckx9111;
Place of Origin: China;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Supplier Name

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

Shenzhen Chipskey Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier