| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80 ºC;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding Electronics;
Certificate: ISO9001, ISO14001, IATF16949, ISO13485.;
Min Hole Size: 0.1mm(4mil);
Min Line Spacing: 0.1mm(4mil);
Solder Mask: Green, White, Black, Blue, Red(Customized);
Board Thickness: 0.2mm-6mm;
Copper Thickness: 0.5oz-6oz(18um-210um);
Service: PCB/PCBA/Circuit Board/SMT/DIP;
PCBA QA: X-ray, Aoi Test, Function Test(100% Test);
Products Name: One-Stop PCB Assembly Professional Turnkey PCBA;
Original: Shenzhen Guangdong;
MOQ: 1PCS;
Surface Finishing: HASL Lead Free, Immersion Gold/Silver.OSP.;
Industrial: LED, Control Board, Motherboard.;
Design: PCBA Layout and Engineering Support.;
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Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
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