| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80 ℃;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
Solder Mask Color: Green, White, Black, Blue, Red(Customized);
Board Thickness: 0.2mm-8.0mm;
Copper Thickness: 0.5-100oz(18-3500um);
PCB Material: Xfr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Surface Finishing: HASL Lead Free, Immersion Gold/Silver.OSP.;
Industrial: LED, Control Board, Motherboard.;
Design: PCBA Layout and Engineering Support.;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB;
PCBA Testing: in-Circuit Test (Ict), Functioal Test (Fct), X-ray;
Service: PCB, Components Sourcing, Assembly, Test, Package;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-2;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Conditions: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: X-ray, Aoi, Ict, Fct;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: X-ray, Aoi, Ict, Fct;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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