Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80 ºC;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Application: LED Driver Circuit Board;
Moisture and Dust Prevention: Comformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Production Time: Within 4 Weeks;
Copper Thickness: 1-4oz;
Keywords: Multilayer Electronic Circuit Board;
Certificate: ISO 13485;
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