Specification |
MOQ: 1 PCS;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5oz, 1oz, 2oz;
Board Thickness: 0.2mm-4mm;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Printed Circuit Board PCBA Board, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
Specialised: Medical, Industrial, Control Board, CE;
Product Name: Circuit Board Electronics Air Cleaner Board PCB;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
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