Specification |
MOQ: 1 PCS;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5oz, 1oz, 2oz;
Board Thickness: 0.2mm-4mm;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Printed Circuit Board PCBA Board, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
Specialised: Medical, Industrial, Control Board, CE;
Product Name: Circuit Board Electronics Air Cleaner Board PCB;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Board Thickness: 0.15mm / 0.3mm / Custom;
Custom: OEM;
Copper: 1oz / 1.5oz;
Surface Finish: Enig 1u'';
Layers: 1 Layer / 2 Layers;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
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