Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Mode of Production: DIP/SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Warranty: 2-Year;
Key Words: DC Inverter Compressor Driver Module;
Control Type: 180 Degree Sinusoidal Vector Drivering;
Technical Support: 24-Online Technical Support;
Supplier Type: PCB PCBA;
Type: Communication PCBA;
Carrier Frequency: 5.0K Hz(Adjustable According to Compressor Noise;
Product Name: 3 Phase DC Compressor Driver Inverter PCB PCBA;
Inverter Type: AC -DC-AC Frequency Inverter;
Cooperaion Way: OEM ODM;
Protection: Current Overload /Ipm/IGBT ,Ect;
Communication: Standard Modbus RS485;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2837;
RAM: 1GB;
USB: 4 USB 2 Ports;
Other: 40-Pin Extended Gpio;
Wireless/Bluetooth: Yes;
Application: IoT/Ai;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2837;
RAM: 1GB;
USB: 4 USB 2 Ports;
Other: 40-Pin Extended Gpio;
Wireless/Bluetooth: Yes;
Application: IoT/Ai;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Type: Demo Board;
CPU: Broadcom Bcm2710A1 Quad-Core 64-Bit Soc;
Sdram: 512MB Lpddr2 Sdram;
Bluetooth: Bluetooth 4.2;
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