Specification |
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
Certificate: ISO9001, ISO14001, IATF16949, ISO13485.;
Solder Mask Color: Green, White, Black, Blue, Red(Customized);
Board Thickness: 0.2mm-8.0mm;
Copper Thickness: 0.5-100oz(18-3500um);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Surface Finishing: HASL Lead Free, Immersion Gold/Silver.OSP.;
Industrial: LED, Control Board, Motherboard.;
Design: PCBA Layout and Engineering Support.;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible P;
PCBA Testing: in-Circuit Test (Ict), Functioal Test (Fct), X-ray;
Service: PCB, Components Sourcing, Assembly, Test, Package;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Custom Made SMT PCBA Manufacture Prototype;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: OEM Electronics Circuit Board PCBA for Camera Modu;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: OEM Shenzhen Manufacturer PCBA Contract Components;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Multi-Layers Contract Manufacturing for HDI Rigid;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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