Prototype Printed Circuit Board Electronics PCB /PCBA with Factory Price

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.26

1,000-4,999 Pieces US$0.23

5,000-9,999 Pieces US$0.19

10,000+ Pieces US$0.16

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 4 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Green
  • Silksreen Gold
  • Surface Finihsing Enig
  • Lead Time 6-8 Working Days
  • PCB Design Custom Design Product Provided by Customer
  • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
  • Board Material Fr4, Bt HDI
  • MOQ 1PCS
  • Outline Machining Accuracy +/- 0.1mm (4mil)
  • Min Pad +/- 0.1mm (4mil)
  • Min. Hole Size 0.075mm(3mil)
  • Thickness of Copper Foil Wire 8-240 Um(4oz)

Product Description

Prototype Printed Circuit Board Electronics PCB /PCBA with Factory Price Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication,PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our PCB catalog ...

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PCB Board Manufacturing Comparison
Transaction Info
Price US $ 0.16-0.26/ Piece US $ 0.01-1.00/ Piece US $ 8/ Piece US $ 2.00-5.00/ Piece US $ 2.00-5.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949 - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - -
Annual Export Revenue - US$50 Million - US$100 Million US$2.5 Million - US$5 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM OEM, ODM - -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- -
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: Gold;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
PCB Design: Custom Design Product Provided by Customer;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4, Bt HDI;
MOQ: 1PCS;
Outline Machining Accuracy: +/- 0.1mm (4mil);
Min Pad: +/- 0.1mm (4mil);
Min. Hole Size: 0.075mm(3mil);
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 4 Layers, 8 Layers, Custom;
Legend: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier