6L HASL BGA UL Multi-Layer Printed Circuit Board pictures & photos

6L HASL BGA UL Multi-Layer Printed Circuit Board

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Price

Purchase Qty. Reference FOB Price

1-4,999 Pieces US$5.39

5,000+ Pieces US$0.56

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4
Insulation Materials Organic Resin
Brand Fastline
Transport Package Vacuum Packing
Specification Certificates: UL, ROHS
Trademark FL
Origin China
Board Material Fr-4 (Tg 180 )
Board Thickness 1.6 Mm
Copper Thickness 1 Oz (35um)
Surface Treatment HASL Lead Free
Solder Mask Yellow
Silk Screen White
Flying Probe Test Yes

Product Description

1 Layer to 26 Layer Printed Circuit Board for Electronic Products Fastline could meet all your PCB manufacturing needs, including High multilayer PCB, Aluminum based PCB, HDI PCB, Rigid-flex PCB, heavy copper PCB, and PCB assembly as well. Our products are widely applied in telecom, industrial ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Board Comparison

	6L HASL BGA UL Multi-Layer Printed Circuit Board Contact Now	IR2110pbf DIP-14 IR2110 in-Stock Electronic Components IR2110 IC Chip Drive IC IR2110pbf Contact Now	19 Years PCBA Supplier Custom Service EMS SMT DIP Electronic Factory OEM Printed Circuit Board Manufacturer PCB Assembly PCBA Contact Now	China Electronic Products PCB/PCBA Supplier Contact Now	Quick View Bom List Service IC Chips Microcontroller Transistor Resistor Capacitor Inductor LED Diode Mosfet Electronic Components Contact Now

Transaction Info
	6L HASL BGA UL Multi-Layer Printed Circuit Board Contact Now	IR2110pbf DIP-14 IR2110 in-Stock Electronic Components IR2110 IC Chip Drive IC IR2110pbf Contact Now	19 Years PCBA Supplier Custom Service EMS SMT DIP Electronic Factory OEM Printed Circuit Board Manufacturer PCB Assembly PCBA Contact Now	China Electronic Products PCB/PCBA Supplier Contact Now	Quick View Bom List Service IC Chips Microcontroller Transistor Resistor Capacitor Inductor LED Diode Mosfet Electronic Components Contact Now
Price	US$0.56 - 5.39 / Piece	US$0.10 - 2.20 / Piece	US$0.10 - 2.90 / Piece	US$0.60 - 7.00 / Piece	US$0.10 - 0.50 / Piece
Min Order	1 Piece	1 Piece	2 Pieces	2 Pieces	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr-4 (Tg 180 ); Board Thickness: 1.6 Mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free; Solder Mask: Yellow; Silk Screen: White; Flying Probe Test: Yes;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;
Supplier Name	Fastline Circuits Co., Limited	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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