Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
PCB Design: Custom Design Product;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
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Structure: Single-Sided Rigid PCB;
Dielectric: FR-2;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Brand: Hjh;
Sheet Thickness: 0.8~1.6mm;
Copper Thickness: 35um, 70um;
Color: Brown;
Market: Euro, Asia, Central and South America;
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Structure: Single-Sided Rigid PCB;
Dielectric: CEM-1;
Material: Epoxy Fiber Galss Paper;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss Paper;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: White, Yellow;
Market: Euro, Asia, Central and South America;
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Structure: Single-Sided Rigid PCB;
Dielectric: Rcc;
Material: Aluminum Base;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Rcc;
Brand: Hjh;
Sheet Thickness: 0.6-2.0mm;
Copper Thickness: 15um, 18um, 25um, 35um, 70um, Others;
Protective Film Color: Green;
Thermal Conductivity: 0.6~2.0W;
Aluminum Base Material: 1060 / 5052;
Tg (DSC): >130 Degree;
Breakdown Voltage: AC>/=5kv;
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Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
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