PCBA Circuits Board Control Custom Fr4 PCB Assembly Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.56

1,000-4,999 Pieces US$0.52

5,000-9,999 Pieces US$0.46

10,000+ Pieces US$0.38

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, UL
  • Customized Customized
  • Condition New
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Material Fr4
  • Board Layer 2
  • Board Thickness 1.6mm
  • Copper Thickness 1 Oz
  • Min. Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Solder Mask Green/Blue/Red
  • Silkscreen White/ Black
  • Surface Finishing HASL-Lf
  • Lead Time 8-10 Working Days
  • Test Full Test

Product Description

PCBA Circuits Board Control Custom Fr4 PCB Assembly Factory PCBA Technology: 1) Professional Surface-mounting and Through-hole soldering Technology 2) Various sizes like 1206,0805,0603 components SMT technology 3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 4) PCB Assembly ...

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PCBA Prototyping Comparison
Transaction Info
Price US$0.38-0.56 / Piece US$1.00-30.00 / Piece US$1.00-40.00 / Piece US$1.90-2.70 / Piece US$1.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1,000 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T
Quality Control
Product Certification RoHS, ISO, UL ISO9001, ISO13485, IATF16949 ISO9001, ISO13485, IATF16949 - RoHS, ISO
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 2;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
Test: Full Test;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.3mm;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP, EMS;
Insulation Materials: Organic Resin;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.3mm;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP, EMS;
Insulation Materials: Organic Resin;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-2;
Customized: Customized;
Condition: New;
Product Name: Bluetooth MP3 Speaker PCBA;
Number of Layers: Double-Sided;
Color: Customized Colors;
Insulation Layer Thickness: Conventional Board;
Application: Android Ios;
MOQ: 1000PCS;
Insulation Material: Organic Resin;
Reinforcement Material: Synthetic Fiber Based;
Function: Bluetooth;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Lanke Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier