PCBA Samples, PCBA Replication, PCB Assembly and PCBA Manufacturers

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$3.01 - 4.96 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand Fastline
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark Fastline
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Copper Thickness 1oz
  • Material Type Fr4
  • Surface Treatment HASL Lead Free
  • Solder Mask Green, Red, Blue, Black
  • Silk Screen Color White
  • Board Layer 1 Layer
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Packing Type Carton + Vacuum
  • Lead Time 5-7 Days
  • Thickness of Coverlay 25 Um
  • Board Material Supplier Shengyi
  • Pth Cu Thickness More Than 20
  • Coverlay Colour Yellow;Coverlayer Green Solder Mask
  • Leadtime 13-15

Product Description

PCBA samples, PCBA replication, PCB assembly and PCBA manufacturers Product Description Parameter &Data Sheet Size of PCBA 60.22 X 132.27mm Number of Layers 4 Board Type PCBA Board Thickness 1.6mm Board Material FR-4 1.6mm Board Material Supplier Shengyi Tg Value of Board ...

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PCB Assembly Service Comparison
Transaction Info
Price US$3.01 - 4.96 / Piece US$10.00 - 18.00 / Piece US$0.20 - 0.60 / Piece US$0.11 - 9.90 / Square Meter US$0.11 - 9.90 / Square Meter
Min Order 1 Piece 1 Piece 1 Piece 1 Square Meter 1 Square Meter
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, LC, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - ISO, RoHS, Reach, UL, CQC - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia East Asia(Japan/ South Korea), Domestic East Asia(Japan/ South Korea), Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
Thickness of Coverlay: 25 Um;
Board Material Supplier: Shengyi;
Pth Cu Thickness: More Than 20;
Coverlay Colour: Yellow;Coverlayer Green Solder Mask;
Leadtime: 13-15;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Copper Thickness: H/H0z-5/50z;
Board Thickness: 0.3mm - 3.2mm;
Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG;
Maximum Layer: 20;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier