PCBA
US$2.10-2.50 / Piece
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What is PCBA Circuit Board for Step up Power Boost PCB Module

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$2.50

1,000+ Pieces US$2.10

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL
  • Base Material Fr4
  • Insulation Materials Fr4
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification Certificates: UL, ROHS
  • Trademark FL
  • Origin China
  • Board Material Fr-4 (Tg 135 )
  • Board Thickness 1.6 mm
  • Copper Thickness 1 Oz (35um)
  • Surface Treatment HASL Lead Free
  • Solder Mask Green
  • Silk Screen White
  • Flying Probe Test Yes

Product Description

Product Description Commodity Introduction This is a type of PCB assembly job in the application of Driving recorder . It's composed of SMD assembly and through hole assembly. It's fabricated per IPC-A-610 using supplied Gerber data and bill of material (BOM). The support board is 4 Layers ...

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PCBA Comparison
Transaction Info
Price US$2.10-2.50 / Piece US$0.11-9.90 / Square Meter US$0.11-9.90 / Square Meter US$0.11-9.90 / Square Meter US$10.00-18.00 / Piece
Min Order 1 Piece 1 Square Meter 1 Square Meter 1 Square Meter 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - - - - ISO, RoHS, Reach, UL, CQC
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast East Asia(Japan/ South Korea), Domestic East Asia(Japan/ South Korea), Domestic East Asia(Japan/ South Korea), Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Fr4;
Insulation Materials: Fr4;
Brand: Fastline;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Copper Thickness: H/H0z-5/50z;
Board Thickness: 0.3mm - 3.2mm;
Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG;
Maximum Layer: 20;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier