Custom Design HDI PCB Prototype with Competitive Price pictures & photos

Custom Design HDI PCB Prototype with Competitive Price

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Price

Purchase Qty. Reference FOB Price

1-99 piece US$0.93

100+ piece US$0.88

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-3
Material Phenolic Paper Laminate
Application Computer
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Fr4
Insulation Materials Organic Resin
Brand Fastline
Transport Package Vacuum Packing
Specification IP class -2
Trademark Fastline
Origin Shenzhen, China
Board Material Fr4
Layers 1 to 30 Layers
Board Thickness 1.6mm
Copper Thickness 1oz
Solder Mask Green
Silk Screen White
Surface Treatment HASL Lead Free
Test 100%
Lead Time 6-8 Working Days
Min. Line Width 0.075mm

Product Description

Custom Design HDI PCB Prototype with competitive price Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

HDI PCB Comparison

	Custom Design HDI PCB Prototype with Competitive Price Contact Now	Multilayer China Printed Circuit Board UL Verify PCB HDI Circuit Board Rigid & Mulitilayer PCB Shenzhen Factory Contact Now	Professional ISO14001 Multilayer Rigid Multilayer Circuit Boards Electronic Manufacture PCB Contact Now	Electronic PCB Board Rigid Flexible Rigid Flex PCB Max Black Laser Green Gold Red White Blue Copper Solder Contact Now	94V0 Immersion Gold PCB/ Printed Circuit Board PCB Electronics Products Contact Now

Transaction Info
	Custom Design HDI PCB Prototype with Competitive Price Contact Now	Multilayer China Printed Circuit Board UL Verify PCB HDI Circuit Board Rigid & Mulitilayer PCB Shenzhen Factory Contact Now	Professional ISO14001 Multilayer Rigid Multilayer Circuit Boards Electronic Manufacture PCB Contact Now	Electronic PCB Board Rigid Flexible Rigid Flex PCB Max Black Laser Green Gold Red White Blue Copper Solder Contact Now	94V0 Immersion Gold PCB/ Printed Circuit Board PCB Electronics Products Contact Now
Price	US$0.88 - 0.93 / piece	US$0.10 - 1.00 / Piece	US$0.10 - 10.00 / Piece	US$0.10 - 10.00 / Piece	US$0.10 - 10.00 / Piece
Min Order	1 piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.0mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold/Customized; Solder Mask: Blue; Legend: White/Customized; Layer: Double-Layer;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.60mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold/Customized; Solder Mask: Green; Legend: White/Customized; Layer: Multi-Layer;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.0mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold/Customized; Solder Mask: Blue; Legend: White/Customized; Layer: Multi-Layer;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.0mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold; Solder Mask: Blue; Legend: White/Customized; Layer: 8 Layer;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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