Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: Ad255c;
Material: Ad255c Laminate;
Application: Telecommunications;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Silver;
Base Material: Ad255c Laminate;
Insulation Materials: Ad255c Substrate;
Brand: Unspecified;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: Megtron6 (M6) R-5775;
Material: Multilayer Copper-Clad Laminate (Ccl);
Application: Automotive Engine Room ECU;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Multilayer Copper-Clad Laminate (Ccl);
Insulation Materials: Prepreg R-5670(G) Used in Conjunction with M6;
Brand: Panasonic;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: F4btms1000;
Material: F4btms1000 (High-Reliability Material with Ceramic;
Application: Microwave and RF Applications;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL (Hot Air Solder Leveling);
Base Material: F4btms1000 (High-Reliability Material with Ceramic;
Insulation Materials: Olytetrafluoroethylene Resin Combined with Ceramic;
Brand: Polyclad (F4btms Series);
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: RO4003c Fr-4;
Material: RO4003c (Woven Glass Reinforced Hydrocarbon/Cerami;
Application: Commercial Airline Broadband Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: RO4003c (Woven Glass Reinforced Hydrocarbon/Cerami;
Insulation Materials: Fr-4 Epoxy Resin;
Brand: Rogers and Isola;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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