Custom PCB
US$0.01 - 0.08 / Piece

China RoHS Factory Custom Electronic Prototype Fr4 94V0 Circuit Board PCB Manufacturing with Multilayer PCB Design PCBA Assembling Box Build Assembly Service Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01 - 0.08 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Hemeil
  • Transport Package Vacuum Packaging
  • Specification 20*20
  • Trademark hemeil
  • Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

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Custom PCB Comparison
Transaction Info
Price US$0.01 - 0.08 / Piece US$0.02 - 0.10 / Piece US$0.10 - 80.00 / Piece US$0.10 - 100.00 / Piece US$0.15 - 5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, LC, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification - - UL,ISO9001&ISO14001,SGS,RoHS Report UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
Management System Certification - - - - -
Trade Capacity
Export Markets East Asia(Japan/ South Korea), Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green/ Blue;
Board Thickness: 1.6mm / 1.8mm / Custom;
Custom: OEM;
Copper: 1oz;
Surface Finish: Enig / HASL / L-F HASL;
Layers: 4 Layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Enig: 1-3u'';
Hard Gold: 1-50u'';
Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-8mm;
Copper Thickness: 0.5-8oz;
Supplier Name

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier