Direct Sales From The PCB Source Factory. Multi-Layer Circuit Boards, Single-Layer PCB Circuit Boards, Double-Layer PCB Circuit Boards. PCB Circuit Board Factor Video

Name: Direct Sales From The PCB Source Factory. Multi-Layer Circuit Boards, Single-Layer PCB Circuit Boards, Double-Layer PCB Circuit Boards. PCB Circuit Board Factor
Uploaded: 2025-10-04T07:31:18+08:00
Description: Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your

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Price

Min. Order Reference FOB Price

1 Piece US$0.01 - 0.09 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Hemeil
Transport Package Vacuum Packaging
Specification 20*20
Trademark hemeil
Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

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Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Since 2025

Audited Supplier

Business Type Trading Company
Main Products PCB, PCBA
Number of Employees 3
Year of Establishment 2020-12-18
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Source Factor Comparison

	Direct Sales From The PCB Source Factory. Multi-Layer Circuit Boards, Single-Layer PCB Circuit Boards, Double-Layer PCB Circuit Boards. PCB Circuit Board Factor Contact Now	Quick View Screen Driver PCB Control Board Touch Screen PCB Circuit Board Assembly Multi-Layer Board Manufacturing China Contact Now	Quick View High Standard Fr4 PCB Assembly for LED Driver PCB Board Contact Now	Quick View Wonderful PCBA Copy Clone PCB Reverse Engineering Printed Circuit Board Contact Now	Quick View LED Motion Sensor LED Lights PCB Assembly Daylight LED PCB PCBA Supplier Contact Now

Transaction Info
	Direct Sales From The PCB Source Factory. Multi-Layer Circuit Boards, Single-Layer PCB Circuit Boards, Double-Layer PCB Circuit Boards. PCB Circuit Board Factor Contact Now	Quick View Screen Driver PCB Control Board Touch Screen PCB Circuit Board Assembly Multi-Layer Board Manufacturing China Contact Now	Quick View High Standard Fr4 PCB Assembly for LED Driver PCB Board Contact Now	Quick View Wonderful PCBA Copy Clone PCB Reverse Engineering Printed Circuit Board Contact Now	Quick View LED Motion Sensor LED Lights PCB Assembly Daylight LED PCB PCBA Supplier Contact Now
Price	US$0.01 - 0.09 / Piece	US$0.03 - 3.10 / Piece	US$0.35 - 2.10 / Piece	US$0.50 - 4.60 / Piece	US$0.05 - 3.33 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	East Asia(Japan/ South Korea), Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;
Supplier Name	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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