PCB Source Factor
US$0.01-0.09 / Piece

Direct Sales From The PCB Source Factory. Multi-Layer Circuit Boards, Single-Layer PCB Circuit Boards, Double-Layer PCB Circuit Boards. PCB Circuit Board Factor Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.09 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Hemeil
  • Transport Package Vacuum Packaging
  • Specification 20*20
  • Trademark hemeil
  • Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

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PCB Source Factor Comparison
Transaction Info
Price US $ 0.01-0.09/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.10-1.10/ Piece US $ 1.00-1.30/ PCS
Min Order 1 Pieces 100 Pieces 100 Pieces 1 Pieces 1 PCS
Payment Terms L/C, Paypal T/T T/T T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union
Quality Control
Product Certification - ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/Cqciatf/UL/RoHS/etc ISO,UL,RoHS
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million Above US$100 Million
Business Model OEM, ODM, Own Brand() OEM, ODM, Own Brand(Unice) OEM, ODM, Own Brand(Unice) OEM, ODM, Own Brand(Unice) OEM
Average Lead Time Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Unice;
Layer: 1-20;
OEM/ODM: Support;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Testing: 100%;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Supplier Name

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier