Mass Production Processing
US$0.01-0.09 / Piece

Processing of Double-Layer PCB Circuit Boards, Mass Production of Power Supply Controller Circuit Boards, LED Control Boards, and Multi-Layer Circuit Boards Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.09 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Hemeil
  • Transport Package Vacuum Packaging
  • Specification 20*20
  • Trademark hemeil
  • Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

Learn More

Mass Production Processing Comparison
Transaction Info
Price US $ 0.01-0.09/ Piece US $ 0.90-99.99/ Piece US $ 0.10-0.50/ pcs US $ 0.90-99.99/ Piece US $ 0.10-0.50/ pcs
Min Order 1 Pieces 1 Pieces 1 pcs 1 Pieces 1 pcs
Payment Terms L/C, Paypal T/T, Paypal T/T, Western Union, Paypal, 30 days net T/T, Paypal T/T, Western Union, Paypal, 30 days net
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$10 Million - US$50 Million US$50 Million - US$100 Million US$10 Million - US$50 Million US$50 Million - US$100 Million
Business Model OEM, ODM, Own Brand() OEM, Own Brand(Bicheng) OEM OEM, Own Brand(Bicheng) OEM
Average Lead Time Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: Clte-Xt Laminates;
Material: Ceramic/PTFE Microwave Composite (Clte-Xt);
Application: Power Amplifiers;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Ceramic/PTFE Microwave Composite (Clte-Xt);
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Solder Mask: Green, Black, Blue, Red, Yellow etc;
Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion;
Test Method: Ipc TM-650;
Designation: Clte-Xt;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Type: Flexible Circuit Board;
Dielectric: Polyimide;
Material: Polyimide (Pi) with Stainless Steel Stiffeners;
Application: Keypad FPC;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide (Pi) with Stainless Steel Stiffeners;
Insulation Materials: Polyimide;
Brand: Shengyi;
Board Types: Flexible PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc;
Service Area: Worldwide, Globally;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Supplier Name

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier