| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm or 3mil;
Silk Scre En Min Line Width: 0.006 or 0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
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Type: Motherboard PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Min.Line Snacing: 0.075mm;
Copper Thickness: 1oz;
Min. Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Base Materia: Fr4, Tg;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4.Tg.Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Layer: 1-24 Layers;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Board Size: Custom;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Board Thickness: 0.2-4.0mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ycx;
Copper Thickness: 0.3-60z;
Basematerial: Fr4 Any Specialized Material as Per Your Choice;
Range of Tg: 130-215c;
Min. Hole Size: 0.2mm;
Service: One Stop OEM Services;
Min.Line Spacing: 0.1mm;
MOQ: 1PC;
Layer Count: 1 to 28 Layers;
Twisting and Bending: 0.75%Min:0.5%;
Item: PCB&PCBA;
Silkscreen Colon: Black,Whitered Green;
Board Size: OEM;
Min.Line Width: 0.1 mm;
Board Thickness: 0.3mm-4mm;
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