Aluminium PCB Fabrication
US$0.11 - 9.90 / Square Meter
Smart Home Multilayer PCB for Esp8266 Automation Projects pictures & photos
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Smart Home Multilayer PCB for Esp8266 Automation Projects pictures & photos
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Smart Home Multilayer PCB for Esp8266 Automation Projects pictures & photos
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Smart Home Multilayer PCB for Esp8266 Automation Projects pictures & photos
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Smart Home Multilayer PCB for Esp8266 Automation Projects pictures & photos
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Smart Home Multilayer PCB for Esp8266 Automation Projects pictures & photos
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Smart Home Multilayer PCB for Esp8266 Automation Projects Video

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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$0.11 - 9.90 / Square Meter

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Hemeil
  • Transport Package Vacuum Packaging
  • Specification 20*20
  • Trademark hemeil
  • Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

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Transaction Info
Price US$0.11 - 9.90 / Square Meter US$0.20 - 10.00 / Piece US$0.0001 - 99.00 / Piece US$0.01 - 150.00 / Piece US$0.0001 - 99.00 / Piece
Min Order 1 Square Meter 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, LC, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification - - - UL, ISO9001&ISO14001, SGS, RoHS, Ts16949 -
Management System Certification - - - - -
Trade Capacity
Export Markets East Asia(Japan/ South Korea), Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: New Chip;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 2 Layers;
Thickness: 1.5mm;
Solder Mask: Green;
Legend: Write;
Surface Finish: HASL;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control Module;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 2 Layers;
Thickness: 1.5mm;
Solder Mask: White;
Legend: Black;
Surface Finish: HASL;
Supplier Name

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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