Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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Metal Coating: Epoxy Fiberglass;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Epoxy Fiberglass;
Customized: Customized;
Condition: New;
Application: Insulators, Electrical Winding Insulation, Electrical Base, Shell, Motor;
Type: Insulation Sheet;
Chemistry: Hybrid Insulation;
Maximum Voltage: >100kv;
Classification: Hybrid Insulation Materials;
Material: Fiberglass & Expoxy Resin;
Color: Black;
Brand: Fiberglass+Epoxy Resin;
Thermal Rating: 300;
Durostone: Durostone;
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Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Test: 100%E-Testing;
Color of Silk Screen: Green ,Purple,Black;
Service: OEM / Dfm;
PCB Factory: Yes;
Certificate Gurantee: Yes;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Type: 2 Layer PCBA (PCB Assembly);
According to Designed Files: Meet Customer Requirements;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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