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Advanced Multilayer Motherboards for High-Performance Computing

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Company Profile

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$8.50

500-999 Pieces US$8.00

1,000+ Pieces US$7.50

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Customers Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 10cm*10cm
  • Trademark SNC
  • Origin China
  • Certification IATF16949, UL, ISO
  • Surface Treatment Gold Finger/Hard Gold
  • Test 100% E-Test
  • Layers 1-36 Layers
  • Copper Thickness 0.5-12oz(18-420um)
  • Hole Diameter Min0.05mm
  • Min. Line Spacing 0.10mm(4mil)
  • One Stop Service PCB Assembly, Component Sourcing, Box Building
  • Board Thickness 0.2-6mm
  • Solder Mask Color Green/Black/White/Red/Blue/Yellow
  • Min. Line Width 0.10mm(4mil)
  • Max. Finished Board Side 1020mm*1000mm
  • Delivery 7 Days

Product Description

Detailed Photos Our Service 1. PCB design ,PCB clone and copy ,ODM service. 2. Schematic design and Layout 3. Fast PCB&PCBA prototype and Mass Production 4. Electronic Components Sourcing Services 5. PCB Assembly Services:SMT,DIP&THT,BGA repair and reballing 6. ICT, Constant ...

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Transaction Info
Price US$7.50-8.50 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.10-10.00 / Piece US$0.01-10.00 / Piece
Min Order 100 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms - LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification IATF16949, UL, ISO - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time - Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customers Brand;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Delivery: 7 Days;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Board Thickness: 2.0 mm;
Solder Mask: Blue;
Copper: 35um;
Coat Conforming: Yes;
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: N/a;
Board Thickness: 1.0 mm;
Solder Mask: White;
Field: LED Light;
Silk: Black;
Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Paper Phenolic Copper Foil Substrate;
Application: LED Lighting;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: Immersion Gold;
Solder Mask: White;
Legend: Black;
Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Aluminum Covered Copper Foil Layer;
Application: LED Lighting;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Raw Material: Aluminum;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Layer: 1;
Solder Mask: White;
Legend: Black;
Surface Finish: HASL;
Supplier Name

Kunshan Huaruika Electronics Technology Co., Ltd.

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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