Ai Computing PCB
US$0.60 - 1.20 / Piece
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What is High Density PCBA Assembly for Advanced Ai Computing and Data Processing Devices

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$1.20

1,000+ Pieces US$0.60

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package Anti Static Bubble Wrap Packaging
  • Specification 12x10x11mm
  • Trademark OEM/ODM
  • Origin Shenzhen
  • Certificates ISO13485, IATF16949, UL, CE, RoHS
  • Name PCBA SMT DIP Aoi Electronics Components Assembly
  • Advantages PCBA&EMS Manufacturer
  • Item Electronics Components Assembly

Product Description

Specification PCB capability and services 1.Single-sided,double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. 3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP ...

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Ai Computing PCB Comparison
Transaction Info
Price US$0.60 - 1.20 / Piece US$1.00 - 20.00 / Piece US$1.00 - 20.00 / Piece US$1.00 - 20.00 / Piece US$1.00 - 30.00 / Piece
Min Order 100 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Europe, Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificates: ISO13485, IATF16949, UL, CE, RoHS;
Name: PCBA SMT DIP Aoi Electronics Components Assembly;
Advantages: PCBA&EMS Manufacturer;
Item: Electronics Components Assembly;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Applications: Electronic Manufacturing Service;
Supplier Name

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier