PCB
US$1.00 - 4.00 / Piece
Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA pictures & photos
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Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA pictures & photos
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Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA pictures & photos
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Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA pictures & photos
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Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA pictures & photos
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Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA pictures & photos
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What is Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA

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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer's brand
  • Origin China

Product Description

Product Description OEM manufacturer electronic PCBA circuit board for refrigerator Shenzhen factory Our SMT PCB PCBA manufacture: 1. No MOQ for Printed circuit board and SMT DIP pcb assembling. 2. One-stop solution for various SMT DIP PCB assembly. 3. Professional PCB Board engineer for ...

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2-Layer 0.6mm Wl-CT338 Circuit Board PCB Manufacturing of Shenzhen Electronics

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Transaction Info
Price US$1.00 - 4.00 / Piece US$0.80 - 2.60 / Piece US$0.80 - 2.60 / Piece US$0.90 - 99.99 / PCS US$0.90 - 99.99 / PCS
Min Order 1 Piece 1 Piece 1 Piece 1 PCS 1 PCS
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: RO4003c;
Material: Woven Glass-Reinforced Hydrocarbon/Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Gold;
Board Thickness: 0.5mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
Type: Rigid Circuit Board;
Dielectric: Wl-CT338 PCB;
Material: Thermosetting Resin Hydrocarbon Resin, Ceramics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Surface Finish: Immersion Silver;
Board Thickness: 0.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: Green;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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