PCB
US$1.00-4.00 / Piece
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What is Printed Circuit Board Assembly with Simcom Module Soldering, BGA PCBA, OEM PCBA

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer′s brand
  • Origin China

Product Description

Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company has ...

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PCB Comparison
Transaction Info
Price US $ 1.00-4.00/ Piece US $ 0.51/ Piece US $ 0.34/ Piece US $ 0.45/ Piece US $ 0.40/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal, Cash T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM, IMS service OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Solder Mask Color: Blue;
Copper Thick: 3 Oz;
Legend Color: White;
Surface Finish: HASL Lead Free;
Mininum Trace (Mil): 26 Mil;
Minimum Gap(Mil): 12 Mil;
RoHS Required: Yes;
Thickness of Solder Mask: 13 Um;
Warpage : ≤0.25%;
Test: 100% Electrical Test;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: HASL Lead Free;
Solder Mask Color: Blue;
Legend Color: White;
Board Thick: 1.6mm;
Copper Thick: 3 Oz;
Mininum Trace (Mil): 20 Mil;
Minimum Gap(Mil): 15 Mil;
RoHS Required: Yes;
Warpage: 0.25%;
Test: 100% Electrical Test;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: HASL Lead Free;
Copper Thick: 3 Oz;
Board Thick: 1.6mm;
Solder Mask Color: Blue;
Legend Color: White;
Mininum Trace (Mil): 39 Mil;
Minimum Gap(Mil): 12 Mil;
RoHS Required: Yes;
Warpage: 0.25%;
Test: 100% Electrical Test;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Solder Mask Color: Black;
Legend Color: No Required;
Surface Finish: Immersion Gold;
Board Thick: 1.6mm;
Copper Thick: 1 Oz;
Mininum Trace (Mil): 7.7 Mil;
Minimum Gap(Mil): 6.2 Mil;
Thickness of Solder Mask: 14 Um;
RoHS Required: Yes;
Test: 100% Electrical Test;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier