Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mu Star;
Product Name: PCB Circuit Board PCBA;
MOQ: 1PCS;
Layers: 1-64 Layers;
Board Thickness: 0.4mm-10.0mm;
Copper Thickness: 1-10oz;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4, Bt HDI;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 1200*500mm;
Min Hole Size: 0.075mm (3mil);
Min Conductor Spacing: 0.05mm (2mil);
Min Conductor Width: 0.05mm (2mil);
Surface Finishing: Enig,Immersion Gold, Immersion Tin, OSP;
Min Board Thickness: Single and Double Sized Is 0.1mm;
Min Pad: +/-0.1mm (4mil);
Lead Time: 4-5 Working Days;
Solder Mask: Any;
MOQ: 1 PCS;
Packing: Vacuum and Carton;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Material: Fr4 Tg150;
Regular Board Thickness: 1.6mm;
Board Layer: 2;
Copper Thickness: 1 Oz;
Max PCB Size: 1200*500mm;
Min Hole Size: 0.075mm(3mil);
Min Trace: 0.05mm(2mil);
Min Conductor Width: 0.05mm(2mil);
Min Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
Surface Finishing: Enig, OSP, Immersion Gold, Immersion Tin;
Solder Mask: Any;
MOQ: 1PCS;
Lead Time: 4-5 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Cq;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.15mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White, Black;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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