| Specification | 
                                    
                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Electrolytic Foil;
 Base Material: Copper;
 Insulation Materials: Epoxy Resin;
 Model: PCB;
 Brand: Mzh;
 Board Thickness: 1.0mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm;
 Max Copper: 12 Oz;
 Min Laser Holes: 0.1 mm;
 Service: PCB+PCBA+Components+Reverse Engineer;
 Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
 Min Trace/Space: 3/3 Mil;
 Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
 Inspection Standard: Ipc-II, Ipc-III, Ppap;
 Fastest Delivery Time: 24 Hours (Sample);
 
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                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Immersion Gold;
 Base Material: Fr4;
 Insulation Materials: Epoxy Resin;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Teck: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 
 | 
                                    
                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Immersion Gold;
 Base Material: Fr4;
 Insulation Materials: Epoxy Resin;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Teck: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 
 | 
                                    
                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Immersion Gold;
 Base Material: Fr4;
 Insulation Materials: Epoxy Resin;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Teck: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 
 | 
                                    
                                                                                     Type: Rigid Circuit Board;Dielectric: FR-4;
 Material: Fiberglass Epoxy;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Processing Technology: Immersion Gold;
 Base Material: Fr4;
 Insulation Materials: Epoxy Resin;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Teck: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 
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