Automatic Control Switch Module Circuit Board PCB Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China
  • Capacity 1000000
  • OEM/ODM Available
  • Sample Available
  • Surface Treatment OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes
  • Test 100%E-Testing
  • Min Bonding Pad Diameter 10mil
  • Min Thickness of Soldermask 10um
  • Color of Silk-Screen White, Yellow, Black
  • Data File Format Gerber File and Drilling File, Protel Series, ...
  • Material for PCB High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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PCBA Manufacturing Comparison
Transaction Info
Price US$0.03 - 10.00 / Piece US$0.07 / Piece US$0.70 / Piece US$0.80 / Piece US$0.10 - 0.50 / Piece
Min Order 1 Piece 100 Pieces 108 Pieces 100 Pieces 1 Piece
Payment Terms T/T, PayPal, Western Union LC, T/T LC, T/T LC, T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Operating Temperature: -40°c ~ 85°c (Ta);
Memory Format: Eeprom;
Technology: Eeprom;
Memory Size: 2kb (256 X 8);
Memory Interface: I²c;
Clock Frequency: 400 kHz;
Write Cycle Time - Word, Page: 5ms;
Access Time: 900 Ns;
Voltage - Supply: 2.5V ~ 5.5V;
Mounting Type: Surface Mount;
Package / Case: 8-Soic (0.154", 3.90mm Width);
Supplier Device Package: 8-Soic;
Base Product Number: M24c02;
shape: Surface Mount;
Operating Temperature: 0°c ~ 70°c (Ta);
Technics: Semiconductor IC;
Memory Format: DRAM;
Technology: Sdram;
Memory Size: 256MB (16m X 16);
Memory Interface: Parallel;
Clock Frequency: 166 MHz;
Access Time: 5 Ns;
Voltage - Supply: 3V ~ 3.6V;
Mounting Type: Surface Mount;
Package / Case: 54-Tsop (0.400", 10.16mm Width);
Supplier Device Package: 54-Tsop II;
Base Product Number: W9825g6;
shape: SMD;
Operating Temperature: -40°c ~ 85°c (Ta);
Shape: DIP;
Core Processor: Pic;
Core Size: 8-Bit;
Speed: 20MHz;
Connectivity: Uart/Usart;
Peripherals: Brown-out Detect/Reset, Por, PWM, Wdt;
Number of I/O: 16;
Program Memory Size: 3.5kb (2K X 14);
Program Memory Type: Flash;
Eeprom Size: 128 X 8;
RAM Size: 224 X 8;
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V;
Data Converters: -;
Oscillator Type: Internal;
Package / Case: 18-DIP;
shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: VLSI;
Technics: Thin Film IC;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier