Specification |
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Operating Temperature: -40°c ~ 85°c (Ta);
Memory Format: Eeprom;
Technology: Eeprom;
Memory Size: 2kb (256 X 8);
Memory Interface: I²c;
Clock Frequency: 400 kHz;
Write Cycle Time - Word, Page: 5ms;
Access Time: 900 Ns;
Voltage - Supply: 2.5V ~ 5.5V;
Mounting Type: Surface Mount;
Package / Case: 8-Soic (0.154", 3.90mm Width);
Supplier Device Package: 8-Soic;
Base Product Number: M24c02;
shape: Surface Mount;
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Operating Temperature: 0°c ~ 70°c (Ta);
Technics: Semiconductor IC;
Memory Format: DRAM;
Technology: Sdram;
Memory Size: 256MB (16m X 16);
Memory Interface: Parallel;
Clock Frequency: 166 MHz;
Access Time: 5 Ns;
Voltage - Supply: 3V ~ 3.6V;
Mounting Type: Surface Mount;
Package / Case: 54-Tsop (0.400", 10.16mm Width);
Supplier Device Package: 54-Tsop II;
Base Product Number: W9825g6;
shape: SMD;
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Operating Temperature: -40°c ~ 85°c (Ta);
Shape: DIP;
Core Processor: Pic;
Core Size: 8-Bit;
Speed: 20MHz;
Connectivity: Uart/Usart;
Peripherals: Brown-out Detect/Reset, Por, PWM, Wdt;
Number of I/O: 16;
Program Memory Size: 3.5kb (2K X 14);
Program Memory Type: Flash;
Eeprom Size: 128 X 8;
RAM Size: 224 X 8;
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V;
Data Converters: -;
Oscillator Type: Internal;
Package / Case: 18-DIP;
shape: DIP;
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Conductive Type: Bipolar Integrated Circuit;
Integration: VLSI;
Technics: Thin Film IC;
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