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PCB Circuit Board Manufacturing PCBA Circuit Board Assembly Circuit Board Custom Processing Shenzhen Factory

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Price

Min. Order Reference FOB Price

1 Piece US$0.50-4.60 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Material for PCB Fr-4, Halogen Free, Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. Board ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Rating & Reviews: 4.5/5.0

(2 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

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Transaction Info
	PCB Circuit Board Manufacturing PCBA Circuit Board Assembly Circuit Board Custom Processing Shenzhen Factory Contact Now	Quick View Electronic Equipment Circuit Design Motor Control Board PCBA Contact Now	Quick View Fans PCB Circuits Boards and Assembly Factory Contact Now	Quick View Custom Printed Circuit Boards Single Double Multilayer PCB Contact Now	Quick View Multilayer RF-4 PCB Manufacturer Circuit Board Contact Now
Price	US $ 0.50-4.60/ Piece	US $ 3.00-3.30/ Piece	US $ 0.21/ Piece	US $ 5.31-5.32/ Piece	US $ 0.50-0.65/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, D/P, Western Union, Paypal	L/C, T/T, Western Union, Paypal, Alipay	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal, Alipay	L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Insulation Materials: Organic Resin; Board Material: Fr-4 (Tg 135 ); Board Thickness: 1.6 mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free; Solder Mask: Blue; Silk Screen: White; Flying Probe Test: Yes; Product Name: One Stop Service PCB Assembly PCBA;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Fastline; Board Thickness: 1.6mm; Copper Thickness: 1oz; Material Type: Fr4; Surface Treatment: HASL Lead Free; Solder Mask: Green, Red, Blue, Black; Silk Screen Color: White; Board Layer: 1-50; Shipping Type: DHL, UPS, TNT, EMS, FedEx etc; Packing Type: Carton + Vacuum; Lead Time: 5-7 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Fastline; Board Thickness: 1.6mm; Copper Thickness: 1oz; Material Type: Fr4; Surface Treatment: HASL Lead Free; Solder Mask: Green; Silk Screen Color: White; Board Layer: 1-50; Shipping Type: DHL, UPS, TNT, EMS, FedEx etc; Packing Type: Carton + Vacuum; Lead Time: 5-7 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: FL; Board Material: Fr-4 (Tg 135 ); Board Thickness: 1.6 mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free; Solder Mask: Blue; Silk Screen: White; Flying Probe Test: Yes; Product Name: 12 Layer High Density Interconnect PCB HDI PCB;
Supplier Name	Shenzhen New Chip international Ltd	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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