| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4/High Tg Fr4/Aluminum/Rogers;
Application: All Kinds of Industries;
Flame Retardant Properties: Vo/1/2/UL94/Fr-4;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Layer: 1-20;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Red/Blue/White/Black/Yellow/ etc;
Surface Finish: HASL/HASL Lead Free/OSP/Immersion Gold/Tin/ Silv;
Min Hole Size: 0.2mm;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Packing: Vacuum Package;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Printed Circuit Board Double-Sided PCB Fabrication;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Printed Circuit Board Double-Sided PCB Fabrication;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCB Printed Circuit Board;
MOQ: 1 PCS;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Layer: 1-24 Layer;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz-6oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: CE, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
PCBA Service: Printed Circuit Board PCB PCBA SMT DIP;
Other Service: PCBA/PCB Layout and Design;
Product Name: Multilayer Fr-4 Electronics 94V0 RoHS PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer, LED, Medical, Industrial, Control Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: OEM PCB Board;
MOQ: 1 PCS;
Layer: 1-12 Layers;
Min Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
PCB Service: PCB Board/PCBA/PCB Design and Layout;
Test Service: X-ray, Aoi Test, Function Test(100% Test);
Other Service: PCB/PCBA Layout and Design;
Package: ESD Bag, Foam, Carton Box;
Product Name: ISO9001 Electronics PCBA Assembly 94V0 RoHS PCB;
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