OEM ODM High Design Service PCBA Layout and Design Customized Electronic Motherboard Firmware Software Development pictures & photos

OEM ODM High Design Service PCBA Layout and Design Customized Electronic Motherboard Firmware Software Development

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Price

Min. Order Reference FOB Price

2 Pieces US$0.50-3.10 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Complex
Application Communication
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Vacuum Packaging, Carton Box
Specification FR-4 SILICON COMPONENTS
Trademark New Chip
Origin China
Soldermask Color Green, Yellow, Blue, Black, White...
Sample Available
OEM/ODM Available
Certificate Gurantee Yes
Test 100%E-Testing
Color of Silk Screen Green, Purple, Black
Service OEM / Dfm

Product Description

Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptable components substitution (for PCB assembly). Testing Guide &Test Fixtures if necessary ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Rating & Reviews: 4.5/5.0

(2 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCB Comparison

	OEM ODM High Design Service PCBA Layout and Design Customized Electronic Motherboard Firmware Software Development Contact Now	Buried Via PCB Built on 32 Layer with Single End Impedance and Immersion Gold Contact Now	BGA PCB Circuit Board Built on 4 Layer with Immersion Gold Contact Now	BGA PCB Circuit Board Built on 6 Layer with Impedance Controlled Contact Now	BGA PCB Circuit Board Built on 8 Layer with High Tg170 Fr-4 Contact Now

Transaction Info
	OEM ODM High Design Service PCBA Layout and Design Customized Electronic Motherboard Firmware Software Development Contact Now	Buried Via PCB Built on 32 Layer with Single End Impedance and Immersion Gold Contact Now	BGA PCB Circuit Board Built on 4 Layer with Immersion Gold Contact Now	BGA PCB Circuit Board Built on 6 Layer with Impedance Controlled Contact Now	BGA PCB Circuit Board Built on 8 Layer with High Tg170 Fr-4 Contact Now
Price	US $ 0.50-3.10/ Piece	US $ 9.99/ Piece	US $ 9.99/ Piece	US $ 9.99/ Piece	US $ 9.99/ Piece
Min Order	2 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, D/P, Western Union	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd
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