Digital Analog Multiplexer Breakout Module Flexible PCB Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$20.00

100-999 Pieces US$3.00

1,000+ Pieces US$0.88

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand New Chip
  • Transport Package Vacuum Packaging, Carton Box
  • Specification FR-4 SILICON COMPONENTS
  • Trademark New Chip
  • Origin China
  • Layer 1-32 Layers
  • Service OEM/ODM
  • OEM/ODM Available
  • Test 100%E-Testing
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea
  • Surface Treatmen OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes

Product Description

Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptable components substitution (for PCB assembly). Testing Guide &Test Fixtures if necessary ...

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PCB Comparison
Transaction Info
Price US$0.88 - 20.00 / Piece US$0.11 - 9.90 / Square Meter US$2.00 - 5.00 / Piece US$2.00 - 5.00 / Piece US$2.00 - 5.00 / Piece
Min Order 1 Piece 1 Square Meter 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union T/T, LC, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia East Asia(Japan/ South Korea), Domestic Europe Europe Europe
Annual Export Revenue - - 59,508,592 RMB 59,508,592 RMB 59,508,592 RMB
Business Model ODM, OEM ODM, OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier