Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base;
Board Thickness: 0.4-5.0mm;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Order Qty: Not Limited;
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregular;
Service: Turnkey Assembly PCB PCBA Service;
Customized: Customizable;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Solder Marsk: Green,Black,Blue,Red,Yellow,White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production,PCB Assembly,Components Sourcing;
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Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Functional Testing;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Solder Marsk: Green,Black,Blue,Red,Yellow,White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production,PCB Assembly,Components Sourcing;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Solder Marsk: Green,Black,Blue,Red,Yellow,White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production,PCB Assembly,Components Sourcing;
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