| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-2;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Conditions: New;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-5;
Customized: Customized;
Condition: New;
Soldermask Color: Green;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 0.21--7mm;
Min. Hole Size: 0.10mm;
Min. Line Width: 3mil;
Min. Line Spacing: 3mil;
Surface Finishing: HASL;
Soldermask: Green, Yellow, Black, White, Red;
Silkscreen: White, Yellow, Black;
Special Technological Requirement: Blind & Buried Vias and High Thickness Copper;
Needed: Gerber File, Bom List, Sample If Better;
Board Copy Service: Yes;
PCB Factory: Yes;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Certificate: ISO/UL/RoHS/CQC/IATF;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: Fr4/Al;
Customized: Customized;
Condition: New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Certificate: ISO/UL/RoHS/CQC/IATF;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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