Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base;
Board Thickness: 0.4-5.0mm;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Order Qty: Not Limited;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Service: Turnkey Assembly PCB PCBA Service;
Customized: Customizable;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Blind Hole BGA, DDR;
Application: Automotive Electronics,Security,Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 2oz;
Min Line Width/Space: 0.075mm;
Surface Finish: HASL;
Solder Mask Color: Green;
Layer: 10;
Board Thickness: 2mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Drill Hole 1-3 4-5 6-8;
Application: Automotive Electronics,Security,Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 2oz;
Min Line Width/Space: 0.075mm;
Surface Finish: Enig, OSP, Goldfinger;
Solder Mask Color: Green;
Layer: 2;
Board Thickness: 1mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Automotive Electronics,Security,Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 4oz;
Min Line Width/Space: 0.3mm;
Surface Finish: Enig;
Solder Mask Color: Black;
Layer: 10;
Board Thickness: 2.44mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: High Tg 170;
Application: Automotive Electronics,Security,Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 5oz;
Min Line Width/Space: 0.3mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 2;
Board Thickness: 3.6mm;
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