Specification |
Structure: Metal Base Rigid PCB;
Dielectric: CEM-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
|
Structure: Metal Base Rigid PCB;
Material: Aluminium;
Production Process: Subtractive Process;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 6;
Thickness: 2+/-0.18mm;
Surface: Enig;
Trace: 0.25mm/0.18mm;
QA: Ipc-3;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Power Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Layer Count: 4 Layers;
Board Thickness: 2.0+/-0.2mm;
Min Hole: 0.3mm;
Solder Mask Color: Green;
Surface Treatment: Enig;
Cooper Thickness: All 1 Oz;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 7 Working Days;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Soldermask Color: Green;
Unit Size: 50*20mm;
Finised Copper Thcikness: 35/35um;
Surface Finish: Enig/1u'';
Board Thickness: 1.0mm;
|