| Specification | 
                                    
                                                                                     Metal Coating: Gold;Mode of Production: SMT, DIP, Manual Welding, etc.;
 Layers: Double-Layer;
 Base Material: FR-4;
 Customized: Customized;
 Condition: New;
 Application: Electronic Products;
 Quality Standard: Ipc 610 Class II;
 Board Thickness: 0.4-2.0mm;
 Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
 Min. SMD Size: 01005;
 Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
 Silkscreen Color: Green, White, Black, Blue, Yellow;
 Copper Thickness: 0.5-4 Oz;
 Layer: 1-20 Layers;
 Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
 PCB Testing: E-Test, Fly Probe Test, Visual Checking;
 PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
 Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
 Service: One-Stop Service;
 
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                                                                                     Metal Coating: Copper;Mode of Production: DIP;
 Layers: Multilayer;
 Base Material: FR-4;
 Customized: Customized;
 Condition: New;
 Type: Rigid Circuit Board;
 Dielectric: Fr-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Insulation Materials: Epoxy Resin;
 Processing Technology: Immersion Gold;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Technology: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
 
 | 
                                    
                                                                                     Metal Coating: Copper;Mode of Production: DIP;
 Layers: Multilayer;
 Base Material: FR-4;
 Customized: Customized;
 Condition: New;
 Type: Rigid Circuit Board;
 Dielectric: Fr-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Insulation Materials: Epoxy Resin;
 Processing Technology: Immersion Gold;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Technology: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
 
 | 
                                    
                                                                                     Metal Coating: Copper;Mode of Production: DIP;
 Layers: Multilayer;
 Base Material: FR-4;
 Customized: Customized;
 Condition: New;
 Type: Rigid Circuit Board;
 Dielectric: Fr-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Insulation Materials: Epoxy Resin;
 Processing Technology: Immersion Gold;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Technology: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
 
 | 
                                    
                                                                                     Metal Coating: Copper;Mode of Production: DIP;
 Layers: Multilayer;
 Base Material: FR-4;
 Customized: Customized;
 Condition: New;
 Type: Rigid Circuit Board;
 Dielectric: Fr-4;
 Material: Fiberglass Epoxy;
 Application: Consumer Electronics;
 Flame Retardant Properties: V0;
 Mechanical Rigid: Rigid;
 Insulation Materials: Epoxy Resin;
 Processing Technology: Immersion Gold;
 Copper Thickness: 3oz -105oz;
 Surface Finish: Gold Finger;
 Special Technology: Metal Edging;
 Special 1: Blind Hole;
 Special 2: Buried Vias;
 Special 3: Flex-Rigid PCB;
 Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
 
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