| Specification |
Metal Coating: According to Customer Needs;
Mode of Production: SMT, DIP, Tht;
Layers: Single-Layer, Double-Layer, Multilayer;
Base Material: According to Customer Needs;
Customized: Customized;
Condition: New;
Layer Counts: 2-50 Layers;
Components Size: SMT 01005 to 100mmx80mm;
Minimum Width/Space of Qfp: 0.15mm/0.3mm;
Minimum Diameter /Space of BGA: 0.2mm/0.35mm;
Maximum Part's High: 18mm;
Maximum Part Weight: 30g;
PCB Size: 50mmx 50mm~450mmx 406mm;
PCB Thickness: 0.5mm~4. 5mm;
Placer Speed: 8, 0000 Chips/Hour;
Feeders Number: 140 Piece of 8 mm Reel Feeders;
PCB Material: Fr4, Halogen Free Material, Cem-3, etc;
Solder Mask Color: Green, Red, Black, Blue, White, Yellow, Matt, etc.;
Service: One-Stop Service;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Operation System: Linux;
Memory: 25n01gvze1g;
USB: Type-C;
Serial Port: I2c :1 Uart :3;
USB Interface: 1;
CTP Interface: 1;
Rgbrgb Interface": 1;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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