Raspberry Pi Development Board
US$22.50 / Piece
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What is Raspberry Pi Raspberry Pi Pico 2 W RP2350 Microcontroller Development Board WiFi/Bluetooth

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$22.50 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production DIP
  • Layers Single-Layer
  • Base Material AIN
  • Certification N/a
  • Customized Non-Customized
  • Condition New
  • Transport Package Carton
  • Specification Small Size
  • Trademark Original brand
  • Origin Original
  • Package Standard
  • Function Development and Debugging
  • Application Electronic Project for Control
  • Features Mini Development Board

Product Description

Product Parameters ITEM VALUE D/C New Condition New Package Original Brand PCBA Applications Raspberry PI Dedicated to CSI Conversion Board Series Nano Development Board Description Electronic Project for Control Lead Free Status ROHS Compliant Mounting Type DIP Express ...

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Raspberry Pi Development Board Comparison
Transaction Info
Price US $ 22.5/ Piece Negotiable Negotiable US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification N/a RoHS, CCC RoHS, CCC RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification OHSAS/ OHSMS 18001, QHSE ISO 9001 ISO 9001 ISO 9001, IATF16949, QC 080000 ISO 9001, IATF16949, QC 080000
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model - - - OEM, ODM OEM, ODM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: AIN;
Customized: Non-Customized;
Condition: New;
Package: Standard;
Function: Development and Debugging;
Application: Electronic Project for Control;
Features: Mini Development Board;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 1g;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless;
Environment: Operating Temperature 0–50ºC;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Supplier Name

Shenzhen Junbo Trading Co., LTD

Gold Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier