Manufacture of PCB
US$0.30 - 5.00 / pieces
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What is Smart Electronics Custom PCB Mainboard OEM PCBA Assembly Manufacture of PCB Maker Printers Circuit Board Assembly Service

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$5.00

100-999 pieces US$2.50

1,000+ pieces US$0.30

Sepcifications

  • Type Multilayer PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4,Tg,Cem-1,Aluminium
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification custom
  • Trademark Smart
  • Origin Guangdong, China
  • Number of Layers 2/4/6/8/12/Custom
  • Copper Thickness 0.5-6.0oz
  • Min.Hole Size 0.1mm
  • Min.Line Spacing 0.075mm
  • Certification RoHS, Is09001:2000
  • Min. Line Width 0.15mm
  • Board Size Custom
  • Board Thickness 0.2-4.0mm

Product Description

Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

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Manufacture of PCB Comparison
Transaction Info
Price US$0.30 - 5.00 / pieces US$1.50 - 6.00 / Piece US$1.50 - 6.00 / Piece US$1.50 - 6.00 / Piece US$1.50 - 6.00 / Piece
Min Order 5 pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification RoHS, Is09001:2000 - - - -
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM ODM ODM ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM;
Copper Thickness: 1/2oz 1oz 2oz 3oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.075mm;
Surface Finishing: HASL/OSP/Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM;
Copper Thickness: 1/2oz 1oz 2oz 3oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.075mm;
Surface Finishing: HASL/OSP/Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM;
Copper Thickness: 1/2oz 1oz 2oz 3oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.075mm;
Surface Finishing: HASL/OSP/Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM;
Copper Thickness: 1/2oz 1oz 2oz 3oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.075mm;
Surface Finishing: HASL/OSP/Enig;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Dongguan Access Star Co., Ltd.

Gold Member Audited Supplier

Dongguan Access Star Co., Ltd.

Gold Member Audited Supplier

Dongguan Access Star Co., Ltd.

Gold Member Audited Supplier

Dongguan Access Star Co., Ltd.

Gold Member Audited Supplier