N610040784AA

Negotiable

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What is Panasonic SMT Nozzle 230c N610040784AA Original New/Copy New

Name: Panasonic SMT Nozzle 230c N610040784AA Original New/Copy New
Uploaded: 2025-08-02T12:48:28+08:00
Description: Panasonic SMT Nozzle 230C N610040784AA Original New/Copy New Description: Panasonic Nozzle 230C Part No: N610040784AA Condition: Original new /Copy New Product Tags: N610040784AA Payment Term: T/T,

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About this Item

Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

Condition New
Transport Package Carton
Trademark PANASONIC
Origin China&Japan

Product Description

Panasonic SMT Nozzle 230C N610040784AA Original New/Copy New Description: Panasonic Nozzle 230C Part No: N610040784AA Condition: Original new /Copy New Product Tags: N610040784AA Payment Term: T/T, Paypal, Westernunion are all allowed. Shipping Ways: DHL, FedEx, TNT, UPS,by Sea Lead ...

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SMT PARTS SUPPLY LTD

Gold Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Business Range Electrical & Electronics
Main Products SMT Nozzle, SMT Feeder, SMT Feeder Parts, Mounter Parts, Printer & Disprinter Parts, Feeder Storage Carts, IC Tray Feeders, SMT Peripherals, SMT Cutter, SMT Filter
Management System Certification ISO 9001, ISO 9000, ISO 14001
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Terms of Payment T/T, PayPal, Western Union

N610040784AA Comparison

	Panasonic SMT Nozzle 230c N610040784AA Original New/Copy New Contact Now	China Manufacturers High Precision Eutectic Machine with Multiple Wafer Feeding for Mass Production Contact Now	Factory Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements Contact Now	High-Precision Eutectic Machine Wafer Die Bonder Equipment Contact Now	Factory Wholesale Automatic Die Bonder Die Attach for LED Packaging Assemble Contact Now

Transaction Info
	Panasonic SMT Nozzle 230c N610040784AA Original New/Copy New Contact Now	China Manufacturers High Precision Eutectic Machine with Multiple Wafer Feeding for Mass Production Contact Now	Factory Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements Contact Now	High-Precision Eutectic Machine Wafer Die Bonder Equipment Contact Now	Factory Wholesale Automatic Die Bonder Die Attach for LED Packaging Assemble Contact Now
Price	Negotiable	US$100,000.00 - 1,000,000.00 / Piece	US$100,000.00 - 1,000,000.00 / Piece	Negotiable	US$100,000.00 - 1,000,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	ISO	ISO	RoHS, ISO, CE	ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Europe	Europe	Europe	Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Product Attributes
Specification	Condition: New;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Wafer Die Bonder; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;
Supplier Name	SMT PARTS SUPPLY LTD	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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