Flexible Printed Circuit
US$0.50 / Piece
Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes pictures & photos
\
Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes pictures & photos
\
Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes pictures & photos
\
Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes pictures & photos
\
Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes pictures & photos
\
Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes pictures & photos
\
  • Recommend for you
  • What is Single Button Flex PCB Assembly FPC Manufacturer Flexible PCB for Smart Electronics
  • What is High Quality FPC Professional Manufacturer Custom Flexible PCB for Touch Panel
  • What is Dustproof and Waterproof FPC Membrane Keypad with Durable OEM Service

What is Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes

Contact Now
Get Latest Price
About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$0.50 / Piece

Sepcifications

  • Structure Double-Sided FPC
  • Material Polyimide
  • Combination Mode Without Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Snt-Technology
  • Transport Package Antistatic Bag / Custom Packaging
  • Specification Customized
  • Trademark SNT
  • Origin China
  • Function Durable, Waterproof, Dustproof, UV Resistant
  • Logo/Design Customized
  • Dimension/Shape OEM Service
  • Color Yellow
  • Solder Resists Coverlay

Product Description

FPC Specification (Customized option) Number of Layers Single Sided, Double Sided, Multilayer,Rigid-flex PCB Based Material PI, PET Custom Made: OEM/customize Flexible layers 1~4layer Minimum Trace and Space 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm Minimum Space between Coverlay ...

Learn More

Flexible Printed Circuit Comparison

Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes

Fine-Line, Multi-Layer Flexible Printed Circuit with High Interconnect Density for Data Server Backplanes

Contact Now

Quick View

Customized High Performance China Printed Circuit Board Immersion Gold FPC Manufacturing

Contact Now

Quick View

Prototyping Electronic Printed Circuit Board FPC Manufacturing with Polyimide+Fr4

Contact Now

Quick View

Customized Printed Circuit Boards Immersion Gold FPC Manufacturing with UL, ISO9001 Approved

Contact Now

Quick View

High Value Strong Printed Circuit Board China FPC with UL, ISO9001 Certifications

Contact Now

Transaction Info
Price US$0.50 / Piece US$1.00 - 10.00 / Piece US$1.00 - 10.00 / Piece US$1.00 - 10.00 / Piece US$1.00 - 10.00 / Piece
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms - T/T, D/P, PayPal, Western Union, Money Gram T/T, D/P, PayPal, Western Union, Money Gram T/T, D/P, PayPal, Western Union, Money Gram T/T, D/P, PayPal, Western Union, Money Gram
Quality Control
Product Certification - ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt-Technology;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Yellow;
Solder Resists: Coverlay;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Supplier Name

SNT Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Contact Now
Hot Search