Android11.0 Operating System
US$52.00-60.00 / Piece
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What is Rockchip Rk3568 Android Integrated Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$60.00

100-999 Pieces US$58.00

1,000+ Pieces US$52.00

Sepcifications

  • Integrated Graphics Integrated Board
  • Main Chipset Rk
  • Maximum Memory Capacity 256g
  • Structure ATX
  • Memory DDR4
  • SATA Interface SATA3.0
  • CPU Socket Cortex-A55
  • Printed Circuit Board Eight Layers
  • Main Board Structure CPU Based
  • Audio Effects Not HiFi
  • Transport Package Tbd
  • Specification 145*100*12mm
  • Trademark PaneSeen
  • Origin China
  • USB 7*USB-2.0, 1*USB-3.0, 1*USB OTG
  • Serial Port 4*RS232, 1*Uart Ttl(RS485 Optional)
  • Io Port 4*Io Port
  • Network Support RJ45

Product Description

RK3568 Android integrated board, using Rui Xin Micro quad-core RK3568 and internal integrated NPU chip scheme. The RK3568 is based on the quad-core Cortex-A55 and adopts the new 22nm process 64-bit CPU; The main frequency is up to 2.0GHz; Support for Google Android 11.0 operating system; The GPU ...

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Android11.0 Operating System Comparison
Transaction Info
Price US $ 52.00-60.00/ Piece US $ 162/ Piece US $ 169/ Piece US $ 231/ Piece US $ 255/ Piece
Min Order 10 Pieces 10 Pieces 100 Pieces 100 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Board;
Main Chipset: Rk;
Maximum Memory Capacity: 256g;
Structure: ATX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Cortex-A55;
Printed Circuit Board: Eight Layers;
Main Board Structure: CPU Based;
Audio Effects: Not HiFi;
USB: 7*USB-2.0, 1*USB-3.0, 1*USB OTG;
Serial Port: 4*RS232, 1*Uart Ttl(RS485 Optional);
Io Port: 4*Io Port;
Network: Support RJ45;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Z3.5 Inch;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12g;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: Onboard;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
CPU: Apollo Lake Series;
Cooler: Fan or Fanless;
BIOS: Efi Bois;
RAM: 2g/4G Onboard;
Storage: SSD/HDD Optional;
Series Port: 5 RS232, 1 RS485;
Warranty: 3 Year;
Display: VGA/Lvds/Edp;
Name: Intel Apollo Lake N3350 Motherboard with Edp 2 Eth;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Z3.5 Inch;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
CPU: Intel Core Haswell-U I3 4010u/I5 4200u/I7 4500u;
Chipset: Intel Haswell/Bordwell U Soc;
Capacity: 2GB/4GB;
Double Display Support: Lvds+VGA, HDMI+VGA, Synchronous or Asynchr;
M-SATA: 1*Msata Socket, Supported Sandisk Protocol;
USB: 2*USB3.0 (Compatible USB1.1/2.0) 6*USB2.0;
Mini-Pcle: 1*Minipcie Socket, Supported Pcie and USB Device;
SATA: 2*SATA2.0 Maximum Transmission Rate 3GB/S;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: Onboard;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
CPU: Intel Baytrail;
CPU Package: BGA;
Bois: Efi Bois;
Network: 6 LAN;
Power Consumption: 15W;
Capacity: Onboard 2GB/4GB DDR3;
Size: 17*17;
Cooler: Fan or Fanless;
Name: Intel Baytrail Motherboard Onboard 6 LAN Port DDR3;
Supplier Name

Shenzhen Boxing World Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier