Nvidia Jetson Tx2 Nx Module 4GB Ai Embedded Development Board Computer Carrier Board Case Module pictures & photos

Nvidia Jetson Tx2 Nx Module 4GB Ai Embedded Development Board Computer Carrier Board Case Module

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Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$300.00

10+ Pieces US$295.00

Sepcifications

Processor Type ARM
Stratification HardWare Layer
Range of Application Dedicated
Bus Type Not Bus Type
Type Embedded Board
Transport Package Custom
Specification Official
Trademark Nvidia
Category Module/Developer Kit
Series Jetson
Description Ai Development
Feature Smart Chip
Sdk Jetpack
Condition New
Warranty 1 Year

Product Description

Product . Jetson TX2 NX AI Performance 1.33 TFLOPS GPU 256-core NVIDIA Pascal™ architecture GPU GPU Max Frequency 1.3 GHz CPU Dual-core NVIDIA Denver™ 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor CPU Max Frequency Denver 2: 2 GHz Cortex-A57: 2 GHz ...

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Telefly Telecommunications Equipment Co., Ltd.

Diamond Member Since 2014

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory, Trading Company
Main Products Turbojet Engine, Drone Engine, Turbine Wheel, Vr Glasses, Anti-Drone
Registered Capital 5000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001
Export Year 2004-09-07

Jetson Tx2 Nx Comparison

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Transaction Info
	Nvidia Jetson Tx2 Nx Module 4GB Ai Embedded Development Board Computer Carrier Board Case Module Contact Now	Quick View Hystou Core I5/I7 Can-Bus 6RS232 COM Ports Fanless Mini Nano Industrial PC Contact Now	Quick View Hystou Intel I5/I7 Cheap 6RS232 COM Ports Fanless Can-Bus Mini Industrial PC Contact Now	Quick View Hystou Cheap Industrial Intel I5/I7 8GB Can-Bus Fanless Industrial Nano Mini PC Contact Now	Quick View Hystou Mini I5/I7 Industrial 3display WiFi Can-Bus Embedded Nano Mini PC Contact Now
Price	US$295.00 - 300.00 / Piece	US$278.72 - 287.37 / units	US$278.72 - 287.37 / units	US$282.72 - 292.37 / units	US$278.72 - 287.37 / units
Min Order	1 Piece	1 units	1 units	1 units	1 units
Payment Terms	T/T, D/P, Western Union	LC, T/T, PayPal, Western Union, Money Gram, Visa Card	LC, T/T, PayPal, Western Union, Money Gram, Visa Card	LC, T/T, PayPal, Western Union, Money Gram, Visa Card	LC, T/T, PayPal, Western Union, Money Gram, Visa Card
Quality Control
Product Certification	-	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Eastern Europe, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM	ODM	ODM	ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Processor Type: ARM; Stratification: HardWare Layer; Range of Application: Dedicated; Bus Type: Not Bus Type; Type: Embedded Board; Category: Module/Developer Kit; Series: Jetson; Description: Ai Development; Feature: Smart Chip; Sdk: Jetpack; Condition: New; Warranty: 1 Year;	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Bus Type: Not Bus Type; Type: Embedded Systems; Machine Word-Length: 32; Instruction Type: RISC; Products Status: Stock; Consumption: 75W; Storage: 1M.2 2280 Slot+1SATA3.0 Slot; Size: 23018265mm; Memory Types: 2DDR4 So-DIMM 260 Pin;* Max Memory Size: 64GB; LAN Port: 2RJ45 LAN;* USB Port: 4USB 3.0 Port,4USB 2.0 Port; BIOS: Support Auto Power on,Wake on LAN,RAID,Pxe; Weight: Net 1.9kg; Gross 2.9kg;	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Bus Type: Not Bus Type; Type: Embedded Systems; Machine Word-Length: 32; Instruction Type: RISC; Products Status: Stock; Consumption: 75W; Storage: 1M.2 2280 Slot+1SATA3.0 Slot; Size: 23018265mm; Memory Types: 2DDR4 So-DIMM 260 Pin;* Max Memory Size: 64GB; LAN Port: 2RJ45 LAN;* USB Port: 4USB 3.0 Port,4USB 2.0 Port; BIOS: Support Auto Power on,Wake on LAN,RAID,Pxe; Weight: Net 1.9kg; Gross 2.9kg;	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Bus Type: Not Bus Type; Type: Embedded Systems; Machine Word-Length: 32; Instruction Type: RISC; Products Status: Stock; Consumption: 75W; Storage: 1M.2 2280 Slot+1SATA3.0 Slot; Size: 23018265mm; Memory Types: 2DDR4 So-DIMM 260 Pin;* Max Memory Size: 64GB; LAN Port: 2RJ45 LAN;* USB Port: 4USB 3.0 Port,4USB 2.0 Port; BIOS: Support Auto Power on,Wake on LAN,RAID,Pxe; Weight: Net 1.9kg; Gross 2.9kg;	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Bus Type: Not Bus Type; Type: Embedded Systems; Machine Word-Length: 32; Instruction Type: RISC; Products Status: Stock; Consumption: 75W; Storage: 1M.2 2280 Slot+1SATA3.0 Slot; Size: 23018265mm; Memory Types: 2DDR4 So-DIMM 260 Pin;* Max Memory Size: 64GB; LAN Port: 2RJ45 LAN;* USB Port: 4USB 3.0 Port,4USB 2.0 Port; BIOS: Support Auto Power on,Wake on LAN,RAID,Pxe; Weight: Net 1.9kg; Gross 2.9kg;
Supplier Name	Telefly Telecommunications Equipment Co., Ltd.	Shenzhen Fannis Technology Co., Ltd	Shenzhen Fannis Technology Co., Ltd	Shenzhen Fannis Technology Co., Ltd	Shenzhen Fannis Technology Co., Ltd
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