ROM-2860 Embedded Industrial Motherboards Open Standard Qualcomm Qcs6490 Osm 1.1 Computer on-Module for Advantech

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 unit US$80.00-200.00 / unit

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 8G
  • Structure Rtx Module
  • Memory DDR5
  • SATA Interface SATA3.0
  • Printed Circuit Board Double Layers
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Transport Package Std
  • Specification 45 x 45 mm
  • Trademark Advantech
  • Origin Bj, Cn
  • with CPU Yes
  • Chipset Other
  • Fsb/Ht 2400
  • Socket Typeo Onboard CPU
  • CPU Type Intel
  • Aunch Date 2018
  • Hard Drive Interface SATA
  • Item Condition New
  • Memory Channel Double
  • Products Status New
  • Private Mold Yes
  • Application Server/Workstation

Product Description

Product Description Advantech Embedded Industrial Motherboards Open Standard ROM-2860 Qualcomm QCS6490 OSM 1.1 Computer-on-Module Andreo VPU 633 Andreo GPU 643 ROM-2860 Qualcomm QCS6490 OSM 1.1 Computer-on-Module Features ƒ Qualcomm Arm® v8 Cortex® Gold plus up to 2.7 GHz ...

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Embedded Industrial Computer Comparison
Transaction Info
Price US $ 80.00-200.00/ unit US $ 157.00-166.00/ Piece US $ 75.00-84.00/ Piece US $ 94.00-103.00/ Piece US $ 147.00-156.00/ Piece
Min Order 1 unit 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model - OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia)
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Rtx Module;
Memory: DDR5;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: DDR3l;
SATA Interface: SATA3.0;
CPU Socket: BGA1168;
Main Board Structure: Integrated;
Audio Effects: Realtek Alc662 Audio Decoding;
CPU: 4th Gen I3 I5 I7;
Display: 3 Display;
LAN: 1xrj45;
COM: 6X COM;
Power Supply: DC12V 35W;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: PGA946;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Rui Qi Alc662;
CPU: 4th I3-I5-I7/Pentium/Celeron CPU;
USB: 2*USB3.0 7*USB2.0;
Display: Triple Display;
Power Supply: ATX Power;
COM: 9*RS-232, 1*RS422/485;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA1356;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Realtek HD Alc662;
CPU: Core 8th Generation I3 I5 I7;
USB: 4*USB3.1 6*USB2.0;
Display: 3 Display;
Power Supply: DC12V;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 20GB;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: LGA1151;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Realtek HD Alc662;
CPU: 6th 7th I3-I5-I7 CPU;
USB: 4*USB3.0 5*USB2.0;
Display: Triple Display;
Power Supply: DC 12V;
Serial Port: 5*RS-232, 1*RS232/422/485;
Supplier Name

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier