Som-dB5720 Som-dB5800 Som-dB5920 Development Board COM Express Basic Compact Mini Module for Advantech

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 unit US$80.00 - 300.00 / unit

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 2g
  • Structure COM Express
  • Memory DDR2
  • SATA Interface 4
  • Printed Circuit Board Double Layers
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Transport Package Std
  • Specification 304.8mm x 244mm
  • Trademark Advantech
  • Origin Bj, Cn
  • with CPU Yes
  • Chipset Other
  • Fsb/Ht 2400
  • Socket Typeo Onboard CPU
  • CPU Type Intel
  • Aunch Date 2018
  • Hard Drive Interface SATA
  • Item Condition New
  • Memory Channel Double
  • Products Status New
  • Private Mold Yes
  • Application Server/Workstation

Product Description

Product Description Advantech Development Board SOM-DB5720 for COM Express Basic/Compact/Mini Module with Type 1/2 Pin-out SOM-DB5720 Development Board for COM Express®Type 1/2 Pin-out Modules Features Support SMARC V2.0/2.1 Module ƒSupport several type of display: LVDS, eDP, ...

Learn More

Embedded Industrial Motherboards Comparison
Transaction Info
Price US$80.00 - 300.00 / unit US$193.00 / Piece US$110.00 - 120.00 / Piece US$255.00 / Piece US$108.00 - 139.00 / Piece
Min Order 1 unit 10 Pieces 5 Pieces 100 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets Europe, Southeast Asia/ Mideast, Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 2g;
Structure: COM Express;
Memory: DDR2;
SATA Interface: 4;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Mini-ITX;
SATA Interface: SATA3.0;
Main Board Structure: CPU Based;
Audio Effects: Not HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: 255*210mm;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: LGA1151;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12g;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Supplier Name

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier