Chip Die Bonding System for Lab Using dB100

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$69,000.00-72,000.00 / Piece

Sepcifications

  • After-sales Service Online and Video Service
  • Condition New
  • Speed Medium Speed
  • Precision High Precision
  • Certification CE
  • Warranty 12 Months
  • Automatic Grade Semiautomatic
  • Type Medium-speed Chip Mounter
  • Transport Package Polywood Case
  • Specification 800 * 750 * 630mm
  • Trademark TERMWAY
  • Origin Beijing, China
  • Max. Chip Size Smaller 20mm X20mm(50*50mm Optional)
  • Min. Chip Size 0.2*0.2mm
  • Mounting Precision ±3um 3δ
  • Feeding Mode 2 Inch Waffle Box*2
  • Substrate Size 150*150mm
  • X Y Z Axis Motion System Roller Screw + Servo Motor
  • X Y Axis Resolution 0.1um
  • Power Supply 220V, 50Hz
  • Net Weight 150kg

Product Description

Chip die bonding system for lab using DB100 DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement system, which can ...

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Die Bonder Comparison
Transaction Info
Price US $ 69,000.00-72,000.00/ Piece US $ 320.00-390.00/ Piece US $ 320.00-390.00/ Piece US $ 8.00-14.00/ Piece US $ 258.00-1,200.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Product Certification CE - - - -
Management System Certification ISO 9001, ISO 14001 - - - -
Trade Capacity
Export Markets - - - - -
Annual Export Revenue US$2.5 Million - US$5 Million - - - -
Business Model Own Brand(TORCH) - - - -
Average Lead Time - - - - -
Product Attributes
Specification
After-sales Service: Online and Video Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Semiautomatic;
Type: Medium-speed Chip Mounter;
Max. Chip Size: Smaller 20mm X20mm(50*50mm Optional);
Min. Chip Size: 0.2*0.2mm;
Mounting Precision: ±3um 3δ;
Feeding Mode: 2 Inch Waffle Box*2;
Substrate Size: 150*150mm;
X Y Z Axis Motion System: Roller Screw + Servo Motor;
X Y Axis Resolution: 0.1um;
Power Supply: 220V, 50Hz;
Net Weight: 150kg;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Customization: Available;
Condition: New;
Precision: High Precision;
Types: 0.7 1.0 1.3 1.8 2.5 3.7 5.0 7.0 10.0;
Customization: Available;
Function: Abrasion Resistance;
Condition: New;
Precision: High Precision;
Customization: Available;
Supplier Name

Termway (Beijing) Precision Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier