Chip Die Bonding System for Lab Using dB100

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$69,000.00-72,000.00 / Piece

Sepcifications

  • After-sales Service Online and Video Service
  • Condition New
  • Speed Medium Speed
  • Precision High Precision
  • Certification CE
  • Warranty 12 Months
  • Automatic Grade Semiautomatic
  • Type Medium-speed Chip Mounter
  • Transport Package Polywood Case
  • Specification 800 * 750 * 630mm
  • Trademark TERMWAY
  • Origin Beijing, China
  • Max. Chip Size Smaller 20mm X20mm(50*50mm Optional)
  • Min. Chip Size 0.2*0.2mm
  • Mounting Precision ±3um 3δ
  • Feeding Mode 2 Inch Waffle Box*2
  • Substrate Size 150*150mm
  • X Y Z Axis Motion System Roller Screw + Servo Motor
  • X Y Axis Resolution 0.1um
  • Power Supply 220V, 50Hz
  • Net Weight 150kg

Product Description

Chip die bonding system for lab using DB100 DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement system, which can ...

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Die Bonder Comparison
Transaction Info
Price US $ 69,000.00-72,000.00/ Piece US $ 19,999.00-21,999.00/ Piece US $ 19,999.00-25,999.00/ Piece US $ 19,999.00-25,999.00/ Piece US $ 368.00-568.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification CE null, RoHS, ISO, CE null, RoHS, ISO, CE null, RoHS, ISO, CE CCC, PSE, null, FDA, RoHS, ISO, CE
Management System Certification ISO 9001, ISO 14001 BSCI, ASME BSCI, ASME BSCI, ASME BSCI, ASME
Trade Capacity
Export Markets North America, Europe, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model Own Brand - - - -
Average Lead Time - - - - -
Product Attributes
Specification
After-sales Service: Online and Video Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Semiautomatic;
Type: Medium-speed Chip Mounter;
Max. Chip Size: Smaller 20mm X20mm(50*50mm Optional);
Min. Chip Size: 0.2*0.2mm;
Mounting Precision: ±3um 3δ;
Feeding Mode: 2 Inch Waffle Box*2;
Substrate Size: 150*150mm;
X Y Z Axis Motion System: Roller Screw + Servo Motor;
X Y Axis Resolution: 0.1um;
Power Supply: 220V, 50Hz;
Net Weight: 150kg;
After-sales Service: 24 Hrs Online;
Condition: Used;
Speed: Super High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: Ultra High-speed Chip Mounter;
Chip: 13,200cph;
Use Air Pressure: 0.49+-0.05 MPa;
Component Placement Type: up to 80 Types (Converted to 8mm Tape);
Work Head: One Multi-Nozzle Laser Head (6 Nozzles);
Placement Accuracy Laser Recognition: +-0.05mm;
Feeder Inputs: Max. 80 on 8mm T/F;
After-sales Service: 24 Hrs Online;
Condition: Used;
Speed: Super High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: Ultra High-speed Chip Mounter;
Maximum Board Size (X X Y): 609.6 mm X 508 mm;
Minimum Board Size (X X Y): 50.8 mm X 50.8 mm;
Board Thickness: 0.2mm to 5.0mm, up to 6.0 mm;
Cycle Time: 9 Seconds Standard;
Print Speed: up to 305 mm/Sec (12.0"/Sec);
Power Requirements: 200 to 240 VAC, Single Phase @ 50/60Hz, 15 a;
After-sales Service: 24 Hrs Online;
Condition: Used;
Speed: Super High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: Ultra High-speed Chip Mounter;
Maximum Board Size (X X Y): 609.6 mm X 508 mm;
Minimum Board Size (X X Y): 50.8 mm X 50.8 mm;
Board Thickness: 0.2mm to 5.0mm, up to 6.0 mm;
Cycle Time: 9 Seconds Standard;
Print Speed: up to 305 mm/Sec (12.0"/Sec);
Power Requirements: 200 to 240 VAC, Single Phase @ 50/60Hz, 15 a;
After-sales Service: Video Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: 1-7 Days;
MOQ: 1 PC;
Quality: 100% Tested;
Adaptation: SMT Placement Machine;
Inventory: Availability;
Supplier Name

Termway (Beijing) Precision Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

China Supplier - Gold Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

China Supplier - Gold Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

China Supplier - Gold Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

China Supplier - Gold Member Audited Supplier