PCB Assembly
US$0.08-0.10 / PCS
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What is Printed Circuit Board PCB Copy / Clone and Design Service

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 PCS US$0.10

10-99 PCS US$0.09

100+ PCS US$0.08

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersional Gold
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Ucreate PCB
  • Transport Package Vacuum Packing
  • Specification IPC-Class 2
  • Trademark Ucreate PCB
  • Origin Shenzhen China
  • Board Thickness 1.2~2.0mm
  • Surface Finihsing Immersional Gold
  • Lead Time 6-8 Working Days
  • Certificate ISO,UL,RoHS
  • PCB Testing E-Testing; Flying Probe Testing
  • Mask Ink Color White/Black/Green/Red/Yellow/Blue
  • Color Green Blue Red
  • Number of Layers Multilayer
  • Copper Thickness 2oz
  • Condition Original Made

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.08-0.10/ PCS US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 PCS 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT
Quality Control
Product Certification ISO,UL,RoHS - - - -
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million
Business Model OEM OEM, ODM, Own Brand(KX) OEM, ODM, Own Brand(KX) OEM, ODM, Own Brand(KX) OEM, ODM, Own Brand(KX)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Audited Supplier